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Building a Better Chip in the USA
Why microelectronics firms are targeting advanced packaging
Today, university researchers are collaborating with chip manufacturers to develop ways to combine chips with different functions into a single system via techniques like heterogeneous integration and fan-out wafer-level packaging. These advanced packaging methods are now the hottest area of chip research and development, and figure to remain so as domestic interest in chip manufacturing continues to soar. More about developments in advanced packaging can be found here, here, and here.
Cover images courtesy of Getty Images.
Cover design by Dave Campbell.
Also In This Issue:
• ➜ FROM THE EDITOR
Get expert insight into better, faster, and more efficient ways OEMs make their parts. MORE…
• ➜ TECH UPDATES
Innovative technologies, processes, and services that can help product manufacturers achieve greater productivity or quality. MORE…
• ➜ SOFTWARE & ANALYTICS
The latest software for optimizing product design, development, engineering, and manufacturing. MORE…
• ➜ DESIGN & ENGINEERING
Tools and tips that could help solve engineering problems, jumpstart new designs for better products, and change the way designers and engineers do their jobs. MORE…
• ➜ MADE IN AMERICA
New developments in reshoring, domestic investments in U.S. manufacturing expansion, Foreign Direct Investment (FDI), and Made in USA content. MORE…
• ➜ ADVANCED MATERIALS
Developments in materials that can improve your parts and products — from smart materials to exotic metals and alloys, ceramics, composites, engineered plastics, metamaterials, and more. MORE…
• ➜ ELECTRONICS
Components, circuits, cables, assemblies, electronics manufacturing services (EMS), and more. MORE…
• ➜ INDUSTRY NEWS
News about manufacturing suppliers that OEMs product manufacturers, and sourcing decision makers need to know — plus the latest industry developments and trends. MORE…
May/June 2024
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