Thin Film Interconnects will launch its first U.S. operation with a patented, next-generation production process for the semiconductor device and packaging industry.
FREDERICK, Md.—A pioneering Korean technology firm is set to launch its inaugural U.S. operation with a patented, next-generation semiconductor production process that is reported to surpass current alternatives in speed and reduced environmental impact.
The company, Thin Film Interconnects (TFI), has developed a new 3DIC (three-dimensional integrated circuit) process that reportedly allows layering of multifunction, greater miniaturization, and customization. It is also said to yield a remarkable 40 percent reduction in chip process costs.
Thin Film Interconnects Founder Ty (Tae Young) Lee said in a release that TFI is planning to expand its operations into Maryland, in the vicinity of Frederick. “In 2024, TFI will build a demonstration facility to introduce a new, improved production method to the semiconductor device and packaging industry,” said Lee in the release.
Work is underway now, thanks in part to a program that connects international companies to the local business landscape. Thin Film Interconnects engaged the Frederick Innovative Technology Center, Inc.’s (FITCI) Soft Landing program, which seeks to accelerate the transition of international companies hoping to establish operations state-side.
The Frederick Innovative Technology Center is a partner in Maryland’s Global Gateway Initiative, managed by the Maryland Department of Commerce. The initiative, along with the CHIPS and Science Act of 2022, is aiming to further strengthen America’s presence in the critical semiconductor industry.
“As an incubator and accelerator, we are committed to providing comprehensive support for emerging entrepreneurs as they push scientific boundaries, create jobs, and establish viable businesses as the foundation of a healthy economy,” said Kathie Callahan Brady, CEO of Frederick Innovative Technology Center, Inc., in a release from FITCI.
Callahan Brady emphasized the Soft Landing’s role in facilitating a healthy network of local enterprises across the spectrum for mutual support, adding that she is enthusiastic about TFI’s technology as it aligns with current startup clients. “This will be a game-changer,” she said.
Semiconductors, the foundation of modern computation, play a crucial role in manufacturing various products, including cars, appliances, smartphones, and medical equipment. In recent years, global semiconductor shortages have impacted industries, contributing to inflation and revealing economic and defense vulnerabilities.
Thin Film Interconnects’ innovative method is said to address communication bottlenecks, enabling massive data storage and faster processing. The new process, called wet metallization, is positioned as a more sustainable alternative to current semiconductor manufacturing processes, the company said in the release.
“TFI’s technology promises some exciting benefits to those manufacturing and developing advanced device packaging, and I’m excited to be a part of this effort,” said All Scientific President Brandon Frazier, who is part of the building project, in the release.
Callahan Brady echoed the sentiment, highlighting TFI’s proven success and commitment to excellence. “We’re delighted they chose Frederick for their homebase and honored to help them with the next step in their journey,” she said.
Thin Film Interconnects’ chosen location, FITCI’s entrepreneurial community at 321 Ballenger Center Drive, is part of Frederick City’s thriving bioscience enclave. It is a federal opportunity zone, situated at the crown of Maryland’s thriving technology corridor.
The FITCI program supports companies in the life sciences, biotechnology, agricultural technology, clean energy, and technology sectors with market entry guidance, strategic growth and advisory boards, and connection to local resources and industry partners. The program also offers relocation information, networking, and cultural transition assistance, according to the release.