The U.S. Department of Defense recently announced an award of $46.2 million to GreenSource Fabrication LLC (GreenSource) via the Defense Production Act Investment (DPAI) Program. The award will enhance existing production capabilities at a manufacturing facility for state-of-the-art integrated circuits (IC) substrate, high-density interconnect (HDI) and ultra-high-density interconnect (UHDI), and advanced packaging, according to a release from the DoD.
“Re-shoring advanced packaging and assembly are essential to increase semiconductor supply chain security,” said Assistant Secretary of Defense for Industrial Base Policy Laura Taylor-Kale, Ph.D., in a statement. “Expanding domestic production capability for printed circuit boards and advanced packaging is necessary to avert a shortfall that would severely impair national defense capability.”
The award will enable GreenSource to scale up engineering, tooling, and manufacturing operations to establish a dedicated facility for IC substrate fabrication for a high-mix, low-volume offering of advanced interconnect solutions. These domestic production capabilities for high-density interconnect, ultra-high-density interconnect, integrated circuits substrates, and advanced packaging are critical enabling technologies for sixth-generation systems and applications, including for radar, electronic warfare, information processing, and communications, the release said.
In calendar year 2023, the DPAI Program made 25 awards totaling $781 million. The Defense Production Act Investment Program is overseen by the Assistant Secretary of Defense for Industrial Base Policy’s Manufacturing Capability Expansion and Investment Program (MCEIP), in the Office of the Deputy Assistant Secretary of Defense for Industrial Base Resilience.